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Selection Guide

Correct Thermal Interface Material Selection Guide

Selection of the correct Thermal Interface Material (TIM) is critical to the performance for each device. Proper selection is based on various material properties; Thermal Resistance, Voltage Isolation, Service Temperature and Wetting Properties. While selecting the right material involves considering the chemical and physical properties of the material, it also means choosing a product that will ensure the longest possible life expectancy in the working environment. Using the best material for the job can decrease your overall cost because otherwise similar products may have different price/performance ratios.

Thermal Interface Gap Filler

GP Series UTP100 TP400 TP300 TP250 TP200 TP150 TP080
Form Gap Filler Pad Gap Filler Pad Gap Filler Pad Gap Filler Pad Gap Filler Pad Gap Filler Pad Gap Filler Pad
Polymer Silicone / Ceramic Silicone / Ceramic Silicone / Ceramic Silicone / Ceramic Silicone / Ceramic Silicone / Ceramic Silicone / Ceramic
Color Brown-Red Shallow Blue Bright Blue Bright Yellow Dark Gray Dark Gray Gray
Thickness (mm) 0.25 - 5.0 0.5 - 5.0 0.5 - 5.0 0.5 - 5.0 0.5 - 5.0 0.5 - 5.0 0.25 - 5.0
Density (g/cc) 2.5 3.15 2.7 2.93 2.79 2.5 2.2
Thermal Conductivity (W/m-K) 1.0 4.0 3.0 2.5 2.0 1.5 0.8
Sheet Stock Yes Yes Yes Yes Yes Yes Yes
Fabrication Die cut Die cut Die cut Die cut Die cut Die cut Die cut
Multilayer Capable 0.5mm up 0.5mm up 0.5mm up 0.5mm up 0.5mm up 0.5mm up 0.5mm up
Ultra Soft Min. Thickness 0.25mm up 0.5mm up 0.5mm up 0.5mm up 0.5mm up 0.5mm up 0.25mm up
Electric Insulation High Low Low Low High High High

Download the Thermal Interface Gap Filler datasheets
Functional Thermal Interface Material

Material Series TC Series TG Series PCM Series
Form Insulator Pad Thermal Grease Electrical conductive thermal pad
Polymer Silicone / Ceramic particles Silicone / Ceramic particles Silicone
Color Megenta White Gray
Thickness (mm) 0.23/0.3/0.45 0.5 - 6.0 < 0.5
Density (g/cc) Vary 2.9 Vary
Thermal Conductivity (W/m-K) 1.6 - 3.5 3.0-5.0 2.5 - 4.0
Sheet Stock Yes No Yes
Fabrication Die cut --- Die cut
Multilayer Capable N/A N/A N/A
Ultra Soft Min. Thickness N/A N/A N/A
Electric Insulation Superior Fair Fair

Download the Functional Thermal Interface Material datasheets
 

Thermalpad.org Can Help You Choose the Right Material

Thermal interface materials can be used in a wide range of electronic products ranging from automotive electronics, telecom, consumer, lighting, military, medical, power supplies, wireless, personal computer, LED, LCD TV, motherboard, DRAM memory module, cooler, vehicle control module, notebook computer etc…wherever there is thermal management issues Our products can provide a cost-efficient and manufacturing-friendly solution. Thermalpad.org offers an industry-leading breadth of expertise in both standard and specialized interface materials. We have an experienced engineering and development team that has the material knowledge to assist you in selecting the right material for your application.

Thermal Grease is an opaque white heat sink grease compound, which is applied to the base and mounting studs of transistor and diodes to provide a positive heat sink seal, this facilitates heat transfer away from electrical/electronic components and into heat sinks, thereby increasing the overall efficiency and performance of the device. We strive to provide complete solutions every time for our customers, so we offer a wide range of engineering services and technical support for both new and existing applications.

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With so many options, it’s clear that now more than ever you should seek expert help to specify materials. You can place an order online quickly and easily.

 

thermalpad.org provides performance-enhancing solutions to serve the diverse needs of more than 8,000 customers worldwide. A global leader in silicones, silicon-based interface material technology and innovation. We specifically to explore and develop the potential of silicones.
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