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AOK Advanced Materials for Thermal Management of Power Supply

Advanced Materials for Thermal Management of Power Supply:

1. Why Need Advanced Thermal Management Materials...

2. What is Thermal Management in Electronics Packaging?

3. What's The Basic Methods of Heat Transfer?

Why Thermal Management for Power Supply?

  • to ensure safe operating conditions
  • to meet lifetime, reliability and safety requirements
  • One of the most important considerations in the design and selection of a power supply is its thermal management. Here we examine the pathways for heat transfer and how power supply designs have evolved to enable effective heat dissipation and deliver greater performance.

    Heat-dissipation efficiency has a direct impact on the performance of a power supply. Electronic circuits often perform more efficiently at lower temperatures and will in turn tend to dissipate less energy as wasted heat. The efficiency gains that can be obtained through effective cooling increase significantly as the power output of the overall system increases. Higher temperature operation can also have an effect on reliability. Systems that run cooler will have a lower probability of failing within a given time. These factors make it important to consider all possibilities when looking at the cooling options for power supply designs.

    What is Thermal Management in Electronics Packaging?

    Thermal management in electronics packaging addresses problems associated with degradation of a device or system at high temperatures. It is a critical part of packaging design. The continuing trends for compact, more highly integrated devices with smaller feature sizes and higher currents places greater emphasis on thermal management and control to ensure reliable operation.

    Heat can be introduced into a device or system through active device operation or through transfer from the surrounding environment. To ensure proper package and device performance, this heat must be transferred out of the system. Performance issues may include a reduction of system speed, loss of noise margin, and catastrophic breakdown.

    What's The Basic Methods of Heat Transfer?

    There are three basic methods of transferring heat from a package or device: convection, conduction, and radiation. Methods of convection whereby heat is transferred from the surface of a solid to a surrounding gas or fluid include the use of base plates and heat pipes. Conduction refers to the transfer of heat through a solid medium. The choice of materials used for device and substrate affect the ability of the system to conduct heat away. Heat-sinks such as copper, aluminium, or copper and aluminium alloys are used for rapid transfer of heat from high power devices. Thermal radiation is the electromagnetic radiation produced due to temperature. Although radiative heat transfer does occur, its impact is typically far less than convective or conductive means.

    Available in several different forms to suit various applications

    These materials are available in sheet form and die-cut configurations. An optional acrylic adhesive layer (with PSA) is available on one or two sides. With a proven track record spanning several decades in multiple applications, these products are the first choice for high-end power supplies, industrial, aerospace, and military/avionics applications.

    Thermal management applications in electronic components and devices

    With the increasing demands being made on electrical and electronic devices, there is an ever-growing need for effective thermal management. The higher temperatures occurring as a result of increased miniaturization and device output must be controlled to ensure reliability and long service life.

    Thermalpad.org expanded silicone products are being successfully used for thermal management in electronic components and devices. They are lightweight and offer high, direction-dependent thermal conductivity, which is adjustable within a certain range.

    Thermal Caps

    - Application scene: vertical MOSFET on PCB
    - Applied Material: Thermal Caps
    - Functions:
    1) high electrical insulation
    2) good thermal conductive property

    Thermal insulator (TC900S/TC series)

    Application Scene: flat MOSFET secured with screws
    Applied Material: Thermal insulator (TC900S/TC series)
    Functions:
    1) high electrical insulation
    2) good thermal conductive property

    Power Supplies Application)

    Thermalpad.org Providing Cost-Effective, Easy-to-Use Solutions to Difficult Cooling Problems!

    Thermalpad.org provides unique, creative solutions to the leading manufacturers of power supply around the world. By designing, developing and delivering cutting edge technical solutions to complex thermal management challenges, Thermalpad.org has developed a reputation of improving both application performance and reliability while reducing overall cost.

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