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AOK Advanced Materials for Thermal Management of Electronic Packaging
Thermal management of today's telecommunications equipment designs is more critical than ever. Low profiles, rack mounting, and high ambient temperatures in equipment cabinets are few of the thermal management challenges designers face today.

Advanced Materials for Thermal Management of Electronic Packaging:

1. Why Need Advanced Thermal Management Materials...

2. What is Thermal Management in Electronics Packaging?

3. What's The Basic Methods of Heat Transfer?

Advanced Thermal Management Materials Needed

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges became barriers to the electronic industry's ability to provide continued improvements in device and system performance. In order to meet your thermal management needs AOK has developed the TP series line of Thermal Interface Materials. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web services all require components that can dissipate heat efficiently. This requires that the materials have a high capability for dissipating heat and maintaining compatibility with the die and electronic packaging. In response to these critical needs, revolutionary advances in thermal management materials and technologies for active and passive cooling now promise integrable and cost-effective thermal management solutions.

What is Thermal Management in Electronics Packaging?

Thermal management in electronics packaging addresses problems associated with degradation of a device or system at high temperatures. It is a critical part of packaging design. The continuing trends for compact, more highly integrated devices with smaller feature sizes and higher currents places greater emphasis on thermal management and control to ensure reliable operation.

What's the Basic Methods of Heat Transfer?

There are three basic methods of transferring heat from a package or device: convection, conduction, and radiation. Methods of convection whereby heat is transferred from the surface of a solid to a surrounding gas or fluid include the use of base plates and heat pipes. Conduction refers to the transfer of heat through a solid medium. The choice of materials used for device and substrate affect the ability of the system to conduct heat away. Heat-sinks such as copper, aluminium, or copper and aluminium alloys are used for rapid transfer of heat from high power devices. Thermal radiation is the electromagnetic radiation produced due to temperature. Although radiative heat transfer does occur, its impact is typically far less than convective or conductive means.

AOK Providing Cost-Effective, Easy-to-Use Solutions to Difficult Cooling Problems!

AOK isn’t your typical component supplier; we work with our customers to ensure that they get the right part for the application. AOK’s Collaborative Solution Process is a process in which we partner with our customers to create safe and effective custom solutions that meet their business needs.

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