Advanced Materials for Thermal Management of Computer

Advanced Materials for Thermal Management of Computer:

A VARIETY of new advanced interface materials that provide great advantages over conventional materials for thermal management and electronic (also called microelectronic) packaging are available now. Most electronic components are low power and produce negligible amounts of heat in their operation. Some devices, however – such as power transistors, CPUs and power diodes – produce a significant amount of heat and measures may be necessary to take account of this in order to prolong their working life and increase reliability.

A heatsink thermal pad is a small, usually square pad that is typically used with a central processing unit (CPU) and heatsink to create a better system of thermal conductivity. This is often used instead of thermal paste since it is less messy than the paste and is sometimes included with a newly purchased heatsink rather than thermal paste. A heatsink thermal pad is typically less effective than thermal paste, however, so any computer user looking to overclock his or her CPU should consider using the paste rather than a pad.

Inside of a computer tower, or case, the CPU is connected directly to the motherboard. As the computer functions, the CPU can very quickly heat up, and without proper cooling, the computer may shut down or not start up properly and the CPU can actually melt inside the computer. This cooling is typically achieved by using a heatsink, a device connected to the CPU that transfers heat away from the CPU and disperses the heat throughout the computer, where it passes out of the tower by the fans on the case.

For the heat transfer to properly occur between the CPU and the heatsink, they must come in contact as perfectly as possible. Microscopic flaws in the surface of the CPU and heatsink, however, reduce this contact and lessen the effectiveness of a heatsink. A heatsink thermal pad or thermal paste is used to fill in any of the gaps from these flaws and create more effective heat transfer. The heatsink thermal pad is placed between the CPU and heatsink and creates more flawless connectivity.

These materials are available in sheet form and die-cut configurations. An optional acrylic adhesive layer (with PSA) is available on one or two sides. With a proven track record spanning several decades in multiple applications, these products are the first choice for high-end power supplies, industrial, aerospace, and military/avionics applications.

Available in several different forms to suit various applications.

AOK Providing Cost-Effective, Easy-to-Use Solutions to Difficult Cooling Problems!

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