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TCP120 Thermal Gap Pad

tp120 gap pad

Super soft and compliable material allows for less pressure on the heat source, such as the IC or PCB. The power density requirements continue to increase and the ability of thermal interface materials has not kept pace. Increasing effective thermal conductivity and reducing bondline thickness reduce thermal resistance.

TCP120 is a cost-effective and compliant gap filler thermal interface material with excellent thermal performance and great handling for mass-production applications. With a thermal conductivity of 1.2 W/m-K, low thermal resistances can be achieved at low pressures. TCP120 is offered with a hard, metallized liner option for easy handling and improved rework. This metallized liner offers better thermal transfer than other silicone based liners found on comparable products. The metallized liner's lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis.

Material Features:
-Good thermal conductivity
-Extremely soft and cost effective
-Naturally tacky
-Electrically insulating

Material Applications:
- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
- Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink

We are manufacturer specialize in thermal gap pad interface materials, we offer very reasonable price and good quality products for our customers. If you have more questions about our products and thermal management solutions, please do not hesitate to contact us by Email:sales@thermalpad.org.

We have significant experience in the thermal management arena and look forward to working with our customers, wherever they are in the world, and however demanding their needs are.

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Address: Baoan District, Shenzhen City, China

Tel: (86)-755-28085431

Fax: (86)-755-28085431

E-mail: Sales@thermalpad.org

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